IT66612: 1-to-2 HDMI Active Splitter with EDID RAM and Embedded MCU

The IT66612 is a one-to-two HDMI active splitter that supports a signaling rate of up to 3.0 Gbps. 

IT66612是一款一对二HDMI有源分配器，支持高达3.0 Gbps的信号速率。

It is compatible with the latest HDMI 1.4b. 

它兼容最新的HDMI 1.4b。

Withl3.0 Gbps capability, the IT66612 can support content stream such as the new 4K x 2K format, 1080P@120 Hz, 3D video with 1080P/3D@60 Hz in HDMI. 

凭借3.0 Gbps的能力，IT66612可以支持新的4K x 2K格式，1080P@120 Hz, HDMI 1080P/3D@60 Hz的3D视频等内容流。

Via IT66612, the ultra-high definition video content can be split to all its outputs.

通过IT66612，可以将超高清视频内容拆分到其所有输出。

To achieve a friendly remote control environment, the IT66612 provides a complete solution of HDMI CEC function. 

为了实现友好的远程控制环境，IT66612提供了完整的HDMI CEC功能解决方案。

With IT66612's embedded CEC hardware, developers could use high-level software API to implement all the necessary remote control commands easily.

使用IT66612的嵌入式CEC硬件，开发人员可以使用高级软件API轻松实现所有必要的远程控制命令。

The IT66612 equalizes incoming TMDS signal to optimal and outputs retimed data to downstream sinks. 

IT66612将输入的TMDS信号均衡到最佳，并将重新定时的数据输出到下游sink。

The highly acclaimed equalizationl technology of ITE TECH. INC. provides support of long or low-quality HDMI cables at even the highest speeds. 

ITE TECH. INC.高度赞誉的均衡技术即使在最高速度下也可以支持长或低质量的HDMI电缆。

Input terminations of the TMDS inputs and output current levels are both programmable.

TMDS输入端的输入端和输出电流电平都是可编程的。

An EDID RAM is embedded in IT66612 to save the cost of the external EDID ROMs. 

在IT66612中嵌入一个EDID RAM以节省外部EDID rom的成本。

The process of downloading the EDID data into the RAM is simplified by firmware programming. 

通过固件编程简化了将EDID数据下载到RAM中的过程。

Also, each IT66612 chip comes preprogrammed with a unique Source and a Sink HDCP key, in compliance with the HDCP 1.4 standard so as to provide secure transmission of high-definition content. 

此外，每个IT66612芯片都预先编程了一个唯一的Source和Sink HDCP密钥，符合HDCP 1.4标准，从而提供高清内容的安全传输。

Adopters are not required to purchase any HDCP keys or ROMs.

采用者不需要购买任何HDCP密钥或rom。

With embedded MCU and Flash, customers need no external Flash and MCU, which saves the BoM cost and board size.

采用嵌入式MCU和Flash，客户无需外接Flash和MCU，节省了BoM成本和电路板尺寸。